发明名称 INSULATION FILM FORMING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an insulation film forming material which has superior insulation property, solvent resistance, heat resistance and proper adherence with a substrate, and can be formed into a desired pattern. SOLUTION: The insulation film forming material made of a polymer, thermosetting agent, and a solvent is characterized by that the polymer is made of alkali-soluble resin in a structure shown by a formula (I). In the formula, R1 is H or CH3 , A OA1 or NA2 A3 (A1 , A2 , A3 : H, C1 -C6 alkyl, C6 -C12 aryl, C7 -C12 aralykyl), and k and m are integers larger than 1, and n an integer equal to or larger than 1.
申请公布号 JP2003092295(A) 申请公布日期 2003.03.28
申请号 JP20010283476 申请日期 2001.09.18
申请人 FUJI YAKUHIN KOGYO KK 发明人 NAKASONE SHINYA;KOSUGE YUJI
分类号 G03F7/022;C08K5/3477;C08K5/42;C08L25/02;G03F7/033;H01L21/312 主分类号 G03F7/022
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