| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor module package of which an optical axis is hard to deviate, and which has a high heat-dissipating performance, is easy to mold and assemble, and is low-priced. SOLUTION: In an optical semiconductor module package, a bottom plate 10 is formed with a Cu-W alloy or copper-based alloy having an excellent thermal conductivity, and also a frame body 20 is formed with an Fe-Ni-Co alloy of which a thermal expansion coefficient approximates to the bottom plate 10. Further, a fixing member 12 for fixing the optical semiconductor module package to a mounting board 30 projects downward from the bottom plate 10 to be integrally formed therewith. Thus, heat transmitted to the bottom plate 10 having the excellent thermal conductivity transmits to the fixing member 12 having the excellent thermal conductivity, thereby dissipating (discharging) the heat to outside the package promptly. Further, as the bottom plate 10 is not present in a portion extending from the frame body 20 to outside, the bottom plate 10 is not caused to curve.
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