发明名称 |
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To solve the problem that an anti-moisture reliability drops in an electronic component which has an interconnection electrode formed on the surface of a substrate. SOLUTION: The electronic component comprises a substrate 101 and an interconnection electrode 102 formed at least on one surface of the substrate 101. The interconnection electrode 102 comprises a central conductor 103, and a coating conductor 104 which is so formed as to coat at least a part of the central conductor 103 and is made of a conductive material having an anti- corrosion property superior to the central conductor.
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申请公布号 |
JP2003092371(A) |
申请公布日期 |
2003.03.28 |
申请号 |
JP20010283264 |
申请日期 |
2001.09.18 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
ONISHI KEIJI;NANBA AKIHIKO;MORITOKI KATSUNORI;FUJII KUNIHIRO;INOUE TAKASHI |
分类号 |
H01L23/12;(IPC1-7):H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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