| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor device for accurately aligning a mask, even with respect to an impurity region later. SOLUTION: The manufacturing method of semiconductor device includes a process for forming a first resist pattern RP1 which has a specified pattern containing an alignment mark pattern on a substrate 10, a process for introducing impurities to a substrate with the first resist pattern RP1 set as a mask, a process for forming a second resist pattern RP2 having a pattern for opening the alignment mark pattern on the first resist pattern RP1, a process for machining the substrate 10 to form an alignment mark AM with the first and second resist patterns RP1 and RP2 as a mask, and a process for removing the first and second resist patterns RP1 and RP2. |
