| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board and a method for inspecting a mounting state of the printed wiring board capable of inspecting a solder state between a lead terminal and a land with respect to the lead terminal which is in a non-conductive state to the other terminals through internal circuits of mounted parts, and further preventing occurrence of a soldering defective state. SOLUTION: A printed wiring board 1 is formed with a fine-band-like land 4 to which lead terminals 12 of surface mounting parts 10 are soldered. The land 4 is divided into an inside division land 4a and an outside division land 4b along a longitudinal direction. The lead terminal 12 is soldered to the land 4 astride the inside division land 4a and the outside division land 4b.
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