发明名称 METHOD AND DEVICE FOR MEASURING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To reduce failure of an electronic part occurring when measuring property of the electronic part. SOLUTION: First and second probes 21A, 21B are made of an elastic conductive material and arranged to respectively contact a base part side and a tip side on the same face of a lead 3 of the electronic part 1. The first probe 21A protrudes the tip part contacting the lead 3 from the second probe 21B and is pressed against the lead 3 from a direction forming an obtuse angle for the base part side of the lead 3. Since the tip of the first probe 21A protrudes from that of the second probe 21B, the tip of the first probe 21A presses the lead 3 stronger than the second probe 21B and accordingly folding of the lead 3 is restrained.
申请公布号 JP2003090849(A) 申请公布日期 2003.03.28
申请号 JP20010286629 申请日期 2001.09.20
申请人 TESETSUKU:KK 发明人 SAITO TAKASHI
分类号 G01R31/26;G01R1/073;G01R31/00;G01R31/28;H01L21/66;(IPC1-7):G01R1/073 主分类号 G01R31/26
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