| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for mounting electronic parts capable of increasing reliability in joining strength between a base plate and the electronic parts on the base plate. SOLUTION: When a solder paste 24 is fused, solder particles are fused in the solder paste 24. A contact between the fused solder 24 on a terminal pad 17 and a solder ball 19 is avoided. At this time, an organic solvent in the solder paste 24 is evaporated in the fused solder 24. As the fused solder 24 has a large surface area and is exposed to an air, the evaporated organic solvent can be relatively escaped from the fused solder 24 to the air. After air bubbles are discharged, the solder ball 19 of electronic parts 13 is carried on the terminal pad 17 on a side of a board 12. After the solder is solidified, the air bubbles, i.e., voids can be restricted in the solder. By eliminating the air bubbles as described above, it is possible to remarkably increase reliability in joining strength between the board 12 and the electronic parts 13.</p> |
