HEAT-RESISTANT ADHESIVE FILM FOR BUILDUP SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To prepare an adhesive film for a buildup substrate having excellent balance between heat resistance and molding processability during bonding and practical solder heat resistance and adhesive strength. SOLUTION: This heat-resistant adhesive film for the buildup substrate consists essentially of 100 pts.wt. of a polyimide resin (A) composed of a tetracarboxylic dianhydride component and a diamine component containing 5-20 mol% of a diaminosiloxane component and soluble in organic solvents, 5-45 pts.wt. of a polyfunctional epoxy resin (B) having >=250 epoxy equivalent and 55-70 deg.C softening point and 0.1-20 pts.wt. of a silane coupling agent (C).