| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing apparatus for a wafer equipped with a weighting device which can suitably follow the inclination of a polishing face on a surface plate and by which a load under constant pressure can be suitably loaded with respect to the whole face of the wafer. SOLUTION: In the polishing apparatus for the wafer, a holding plate 10 holding the wafer 1 is pressed to the surface plate, the wafer 1 is brought into contact with the polishing face on the surface plate, and the surface of the wafer 1 is polished for mirror surface finish. The polishing apparatus is provided with a holding member 24 which comprises a recess 26 opened toward the lower part and by which the holding plate 10 is supported inside the recess 26 so as not to drop off, a ring-shaped elastic member 34 by which the movement in the horizontal direction of the holding plate 10 is permitted to be within an extremely small range, a sheetlike elastic member 38 by which the holding plate 10 is suspended and held movably, within a extremely small range to the vertical direction and the horizontal direction, an airtight space 50 in the recess 26 which is partitioned by the member 38 and a fluid supply means by which a fluid under prescribed pressure is supplied to the airtight space 50. |
