发明名称 THERMOCOUPLE OF SEMICONDUCTOR FABRICATION EQUIPMENT
摘要 PURPOSE: A thermocouple of semiconductor fabrication equipment is provided to prevent a variation of counter electromotive force by removing the short circuit of metal lines. CONSTITUTION: A couple of metal lines(26a,26b) of different kinds are fixed to terminals(28a,28b) in order to prevent the separation and short circuit of the metal lines(26a,26b). A terminal box(20) is contacted with a meter portion. An insulating tube(22) is formed with a sus bellows material. The insulating tube(22) is contacted with the metal lines(26a,26b) in order to insulate the metal lines(26a,26b) and protect temperature. A fixing portion(24) is used for fixing a thermocouple. End portions of the metal lines(26a,26b) fixed to the terminal box(20) are connected with the terminals(28a,28b).
申请公布号 KR20030025004(A) 申请公布日期 2003.03.28
申请号 KR20010057883 申请日期 2001.09.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, BYEONG CHEOL
分类号 H01L21/22;(IPC1-7):H01L21/22 主分类号 H01L21/22
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