Exposure apparatus, exposure method and process for producing device

摘要

Disclosed is a step-and-scan exposure method improved in exposure at a periphery of a wafer. An area illuminated by an exposure beam is made to relatively scan a shot area positioned at the wafer periphery from the outside of the wafer to the inside. Predetermined measurement points of a sensor for detecting positional information of a wafer with respect to a focal position of a projection optical system in the direction of the optical axis of the projection optical system are made to relatively scan along with the illumination area of the exposure beam. Focus control is performed to make the wafer move in the direction of the optical axis when only part of the selected predetermined measurement positions reach the wafer, and leveling control is performed in addition to adjust the tilt of the wafer when all of the selected predetermined measurement positions reach the wafer.