发明名称 |
Image sensor for printed circuit board has C-shaped metal plates providing input and output terminals combined with injection molded structure defining hollow space for photosensitive chip |
摘要 |
<p>The image sensor has a matrix of C-shaped metal plates (30) providing signal input and output terminals, combined with an injection molded structure defining a hollow space (54) housing a photosensitive chip (34), coupled via bonding wires (36) to the signal input terminals and protected by a transparent layer (38). The signal output terminals are soldered to contact surfaces of a printed circuit board (51).</p> |
申请公布号 |
DE20301346(U1) |
申请公布日期 |
2003.03.27 |
申请号 |
DE2003201346U |
申请日期 |
2003.01.29 |
申请人 |
KINGPAK TECHNOLOGY INC., CHUPEI |
发明人 |
|
分类号 |
H01L31/0203;(IPC1-7):H01L23/50;H01L23/057;H01L27/144;H01L31/020 |
主分类号 |
H01L31/0203 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|