发明名称 Image sensor for printed circuit board has C-shaped metal plates providing input and output terminals combined with injection molded structure defining hollow space for photosensitive chip
摘要 <p>The image sensor has a matrix of C-shaped metal plates (30) providing signal input and output terminals, combined with an injection molded structure defining a hollow space (54) housing a photosensitive chip (34), coupled via bonding wires (36) to the signal input terminals and protected by a transparent layer (38). The signal output terminals are soldered to contact surfaces of a printed circuit board (51).</p>
申请公布号 DE20301346(U1) 申请公布日期 2003.03.27
申请号 DE2003201346U 申请日期 2003.01.29
申请人 KINGPAK TECHNOLOGY INC., CHUPEI 发明人
分类号 H01L31/0203;(IPC1-7):H01L23/50;H01L23/057;H01L27/144;H01L31/020 主分类号 H01L31/0203
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