| 摘要 |
A microchip-based electrospray device and method of fabrication thereof are disclosed. The electrospray device includes a substrate (300) defining a channel (336) between an entrance orifice on an injection surface and an exit orifice on an ejection surface, a nozzle defined by a portion recessed from the ejection surface surrounding the exit orifice, and an electric field generating source for application of an electric potential to the substrate to optimize and generate an electrospray. The method includes providing a nozzle and annulus (338) pattern to the polished side of a wafer. The nozzle channel is etched and the back side of the wafer lapped or ground until the nozzle through channel is exposed. The annulus etch may be conducted prior to or following the backgrinding process.
|
