发明名称 |
Semiconductor device inspecting method using conducting AFM |
摘要 |
A semiconductor device inspecting method is provided which can detect electric faults in an in-line inspection. The positive electrode of a variable DC power supply (2) is connected to the back or a peripheral portion of a semiconductor substrate (4) and the negative electrode of the variable DC power supply (2) is connected to a conductive cantilever (3). A scan is performed with a given forward bias voltage (e.g. 1.0 V) applied between the cantilever (3) and the semiconductor substrate (4) and with the cantilever (3) in contact with a target contact plug (9). The current flowing through the cantilever (3) is then monitored with an ammeter (1) to obtain a current characteristic of each contact plug, making it possible to detect conduction faults which cannot be detected by simply observing the configuration.
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申请公布号 |
US2003057988(A1) |
申请公布日期 |
2003.03.27 |
申请号 |
US20020160006 |
申请日期 |
2002.06.04 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MAEDA HITOSHI;OHTA FUMIHITO;IMAI YUKARI;TSUTSUI TOSHIKAZU |
分类号 |
G01R31/28;G01Q30/04;G01R31/04;H01L21/66;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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