摘要 |
Methods for cleaning a microelectronic substrate in a cluster tool are described that include placing the substrate in a pressure chamber of a module in a cluster tool; pressurizing the pressure chamber; introducing liquid CO2 into the pressure chamber; cleaning the substrate in the pressure chamber; removing the liquid CO2 from the pressure chamber, depressurizing the pressure chamber, and removing the substrate from the pressure chamber. Apparatus for processing a microelectronic substrate are also disclosed that that include a transfer module, a first processing module that employs liquid carbon dioxide as a cleaning fluid coupled to the transfer module, a second processing module coupled to the transfer module, and a transfer mechanism coupled to the transfer module. The transfer mechanism is configured to move the substrate between the first processing module and the second processing module.
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申请人 |
MICELL TECHNOLOGIES, INC.;DESIMONE, JOSEPH, M.;DEYOUNG, JAMES, P.;MCCLAIN, JAMES, B. |
发明人 |
DESIMONE, JOSEPH, M.;DEYOUNG, JAMES, P.;MCCLAIN, JAMES, B. |