| 摘要 |
<p>An anisotropic conductive film (14) and circuit devices (16) are superimposedly overlaid on a substrate (10). The circuit devices are pressed isostatically by a press die having a soft layer (22) on the surface to be brought into contact with the circuit devices and heated simultaneously to compression-bond the circuit devices to the substrate. Since the soft layer absorbs the differences in the thickness of the circuit devices, the circuit device can be pressed simultaneously. Furhter, since the circuit devices are heated simultaneously, it is unnecessary to consider the influence of the heat on the unheated adjacent circuit devices. The isotropic conductive film does not overlap sideways because of the isostatic press. As a result, the spaces between the circuit devices can be small.</p> |
