发明名称 SURFACE MOUNTING PACKAGE
摘要 A surface mounting package includes a metal base (1) with a lower surface having a through hole, a metal lead (2) arranged to be inserted into the through hole, an insulating material (3) filling in an internal space defined by the metal base (1), a cap (30) covering the metal base (1) as a lid, and an electronic part component arranged at a surface (2i) on the internal space side of the metal lead (2). The internal space is held at an air-tight atmosphere. The metal base (1) has a lower surface positioned on the same plane as a lower surface of the metal lead (2) or the insulating material (3), the same plane (P) forming a plane to be attached to a mounting board.
申请公布号 WO03026370(A1) 申请公布日期 2003.03.27
申请号 WO2002JP09389 申请日期 2002.09.12
申请人 NEC SCHOTT COMPONENTS CORPORATION;FUKUSHIMA, DAISUKE 发明人 FUKUSHIMA, DAISUKE
分类号 H01L23/04;H01L23/045;H01L23/06;H01L23/10;H03H9/02;H03H9/10;H05K1/02;H05K3/34;(IPC1-7):H05K3/34 主分类号 H01L23/04
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