发明名称 |
Surface package type semiconductor package and method of producing semiconductor memory |
摘要 |
In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.
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申请公布号 |
US2003057113(A1) |
申请公布日期 |
2003.03.27 |
申请号 |
US20020207086 |
申请日期 |
2002.07.30 |
申请人 |
KITAMURA WAHEI;MURAKAMI GEN;NISHI KUNIHIKO |
发明人 |
KITAMURA WAHEI;MURAKAMI GEN;NISHI KUNIHIKO |
分类号 |
B32B27/08;B65D79/02;B65D81/26;H01L21/00;H01L21/673;H01L23/31;H01L23/495;H05K13/00;(IPC1-7):B65D81/26 |
主分类号 |
B32B27/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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