| 摘要 |
Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip die and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening. The die attach adhesive is a curable adhesive composition comprising in combination a curable polymeric base material and contained in said polymeric base material, inorganic insulating particles having average particles sizes of 1 microm to 1000 microm and aspect ratios of the manor axis to the minor axis of about 1.0 to 1.5 and, at least one low coefficient of thermal expansion filler, in an amount of at least greater than 50 weight percent, based on the amount of the curable polymeric base material, and present in sufficient quantities to obtain an adhesive with a linear thermal expansion coefficient before and after any glass transition temperature of less than 240 microm/m/°C, between -55 °C and +200 °C when measured at a heating rate of 5 °C/minute, and wherein there is present less than 0.1 weight percent of the coefficient of thermal expansion filler having sizes in the range of 10 to 100 microm. |
