发明名称 Multilayer board having precise perforations and circuit substrate having precise through-holes
摘要 A perforation of a multilayer board has a surface-profile precision of 8 mum or less, and the ratio of a diameter or the minimum distance between the opposing edges on the opening surface thereof to the axial length is preferably from about 1:1 to 1:15. The multilayer board is fabricated by a punching machine comprising a punch and a stripper such that a required number of plates are prepared, the first plate is perforated by the punch and is pulled up by closely attaching it to the stripper while leaving the punch in the first bore, the second plate is perforated by the punch and is pulled up together with the first plate while leaving the punch in the second bore, and subsequently, the following plates are perforated by the punch and the perforated plates are stacked along the punch serving as a stacking axis sequentially.
申请公布号 US2003056980(A1) 申请公布日期 2003.03.27
申请号 US20020160998 申请日期 2002.06.03
申请人 NGK INSULATORS, LTD. 发明人 TAKEUCHI YUKIHISA;TSUJI HIROYUKI;KITAMURA KAZUMASA;YAMAGUCHI YOSHINORI
分类号 B26F1/02;B32B38/04;H05K3/00;H05K3/42;H05K3/46;(IPC1-7):H05K1/03 主分类号 B26F1/02
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