发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device having memory cells. Each of the memory cells has a word gate formed over a semiconductor substrate with a first gate insulating layer interposed, an impurity layer, and first and second control gates in the shape of sidewalls. The first and second control gates adjacent to each other with the impurity layer interposed are connected to a common contact section. The common contact section includes a first contact conductive layer, a second contact conductive layer, and a pad-shaped third contact conductive layer. The third contact conductive layer is formed over the first and second contact conductive layers.
申请公布号 US2003057505(A1) 申请公布日期 2003.03.27
申请号 US20020244627 申请日期 2002.09.17
申请人 SEIKO EPSON CORPORATION 发明人 EBINA AKIHIKO;INOUE SUSUMU
分类号 H01L21/8247;H01L21/8234;H01L21/8246;H01L27/088;H01L27/10;H01L27/105;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L29/76 主分类号 H01L21/8247
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