发明名称 |
Thermal head lapping apparatus |
摘要 |
A thermal head lapping apparatus includes a pallet for holding at least one thermal head, a transport device for transporting the thermal head held on the pallet successively to a specified processing position, and a lapping device for forcing a lapping material being moved onto the thermal head that has been transported to said processing position. As a result, the apparatus is capable of advantageously performing lapping treatment with a good efficiency on surfaces to be coated with protective layers or the formed protective layers in a process of fabricating a thermal head, thereby improving the production efficiency of the thermal head and fabricating with a food productivity the suitably lapped thermal head of high quality that ensures high quality image recording.
|
申请公布号 |
US2003060146(A1) |
申请公布日期 |
2003.03.27 |
申请号 |
US20000534555 |
申请日期 |
2000.03.27 |
申请人 |
KASHIWAYA MAKOTO;NAKADA JUNJI |
发明人 |
KASHIWAYA MAKOTO;NAKADA JUNJI |
分类号 |
B24B19/26;B24B21/00;B24B27/00;B41J2/335;(IPC1-7):B24B7/00 |
主分类号 |
B24B19/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|