发明名称 Thermal head lapping apparatus
摘要 A thermal head lapping apparatus includes a pallet for holding at least one thermal head, a transport device for transporting the thermal head held on the pallet successively to a specified processing position, and a lapping device for forcing a lapping material being moved onto the thermal head that has been transported to said processing position. As a result, the apparatus is capable of advantageously performing lapping treatment with a good efficiency on surfaces to be coated with protective layers or the formed protective layers in a process of fabricating a thermal head, thereby improving the production efficiency of the thermal head and fabricating with a food productivity the suitably lapped thermal head of high quality that ensures high quality image recording.
申请公布号 US2003060146(A1) 申请公布日期 2003.03.27
申请号 US20000534555 申请日期 2000.03.27
申请人 KASHIWAYA MAKOTO;NAKADA JUNJI 发明人 KASHIWAYA MAKOTO;NAKADA JUNJI
分类号 B24B19/26;B24B21/00;B24B27/00;B41J2/335;(IPC1-7):B24B7/00 主分类号 B24B19/26
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