发明名称 |
Contact array for semiconductor package |
摘要 |
An array of contacts for electrically connecting a semiconductor package to a circuit board. The contacts are carried by a tape having an adhesive border. The tape, along with the contacts, are applied easily to either the substrate or the circuit board using the adhesive border. Each contact is made of two S-shaped pieces in perpendicular directions. The contacts are inserted into holes in the tape and held there by friction.
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申请公布号 |
US2003060061(A1) |
申请公布日期 |
2003.03.27 |
申请号 |
US20010957536 |
申请日期 |
2001.09.21 |
申请人 |
GONZALEZ CARLOS A.;CHANDRAN BIJU |
发明人 |
GONZALEZ CARLOS A.;CHANDRAN BIJU |
分类号 |
H05K3/32;H05K7/10;(IPC1-7):H05K1/00 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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