| 摘要 |
A method of manufacturing a trench conductor line. An etching stop layer, a dielectric layer and a polishing stop layer are sequentially formed over a substrate. The polishing stop layer and the dielectric layer are patterned to form a trench that exposes a portion of the etching stop layer. A conformal dielectric layer is formed over the polishing stop layer and the interior surface of the trench. A portion of the conformal dielectric layer is removed to expose the polishing stop layer and the etching stop layer within the trench. A conductive layer is formed over the polishing stop layer filling the trench. The conductive layer is planarized using the polishing stop layer as a polishing stop.
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