Chip components connecting method, involves producing electrically conductive and flexible microparticles on any of two terminal regions and detachably connecting the regions via microparticles

摘要

The method involves producing electrically conductive and flexible microparticles on any one of two terminal regions. Then the two terminal regions are detachably connected via the flexible microparticles. The connecting step involves soldering of the terminal regions. An Independent claim is also included for a pad for producing a connection between a device and a support.