发明名称 Heat removing module for cooling computer CPU has thermally-conductive ceramic material with heat-removing ribs and fan
摘要 <p>A heat removing device (2) is attached to the top of a CPU (1), and has a fan (3) attached to it. The heat-removing device consists of a heat-conducting ceramic material and comprises several opposing heat-removing ribs (20). Heat generated by the CPU is passed to the heat-removing device and carried away by the fan. The ribs have an elongate strip form. The heat-removing device may be provided with a ceramic tube (4) for carrying heat from the computer using the suction principle.</p>
申请公布号 DE20219779(U1) 申请公布日期 2003.03.27
申请号 DE2002219779U 申请日期 2002.12.20
申请人 CHUANG, YU-FENG 发明人
分类号 H01L23/367;H01L23/373;H01L23/467;(IPC1-7):G06F1/20 主分类号 H01L23/367
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