Leistungs-Halbleiter und Anordnung mit einem solchen

摘要

The invention relates to a power semiconductor (1) which comprises a housing (2) with a first housing side (5) and an opposite second housing side (6). The first housing side (5) is provided with a cooling body (4) for removing dissipated heat. The second housing side (6) defines an alignment plane (12). The semiconductor (1) is further provided with connecting elements (3) that project from the housing (2) and that are bent in the direction towards the second housing side (6) in such a manner that they project beyond the alignment plane (12) of the second housing side (6). In their terminal regions (11), said connecting elements are adapted to receive SMD components of a printed board (13).