SPUTTERING TARGET AND PRODUCTION METHOD THEREFOR

摘要

A sputtering target which is produced after being gone through a mechanical grinding step, characterized in that, in its first embodiment, micro-cracks having depths and lengths of at least specified values are substantially eliminated when the sputter surface of this target is observed in section, and that, in its second embodiment, the sputter surface of a sputtering target produced after being undergone mechanical grinding is sputtered in advance before shipment. A sputtering target can be provided that effectively reduces arcing, especially, an initial arc generation, and significantly enhances an initial stability.