| 发明名称 |
Making semiconductor wafers, employs only single stage of mechanical grinding applied simultaneously to both sides |
| 摘要 |
This grinding is the only mechanically-cutting processing stage with which the surfaces of the wafer are treated. An Independent claim is included for the wafer produced.
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| 申请公布号 |
DE10142400(A1) |
申请公布日期 |
2003.03.27 |
| 申请号 |
DE2001142400 |
申请日期 |
2001.08.30 |
| 申请人 |
WACKER SILTRONIC AG |
发明人 |
PIETSCH, GEORG J. DIPL.-PHYS.;KERSTAN, MICHAEL;HUBER, ANTON |
| 分类号 |
H01L21/304;B24B7/22;B24B37/04;H01L21/302;H01L21/306;H01L21/324;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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