发明名称 |
ELECTRO-CHEMICAL ETCHING APPARATUS |
摘要 |
PURPOSE: An electro-chemical etching apparatus is provided to prevent damage and breakage of the wafer by being supported by an electrode structure during variation of the wafer pressure due to input of etch solution. CONSTITUTION: An electro-chemical etching apparatus comprises a case(30) having the first and second vacuum line(34a,34b), the first packing(36) for sealing openings, a cover(50) for covering the outside portion of a wafer(W) and the second packing(52) for sealing the inside and outside potion of a groove(48).
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申请公布号 |
KR20030023941(A) |
申请公布日期 |
2003.03.26 |
申请号 |
KR20010056709 |
申请日期 |
2001.09.14 |
申请人 |
KEC CORP. |
发明人 |
LEE, GON JAE;LEE, JONG HONG |
分类号 |
H01L21/3063;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/3063 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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