发明名称 HEAD PART OF LED DIE BONDER
摘要 PURPOSE: A head part of an LED die bonder is provided to improve productivity by transferring rapidly an LED chip to an LED lead frame. CONSTITUTION: A head part of an LED die bonder is formed with a rotary driving portion(12), a transferring portion(30), and a housing portion. The rotary driving portion(12) is used for rotating the head part. The transferring portion(30) is located at an end of the rotary driving portion(12) in order to transfer an LED chip to a vacuum shaft(33). The housing portion is installed at an upper portion of the transferring portion(30) in order to shift the vacuum shaft(33) to an upper or a lower direction. The rotary driving portion(12) is formed with a motor fixing plate, a driving motor, a driving pulley, a rotary shaft(19), a rotary pulley, and a belt, A sensing portion(20) is installed at an upper portion of the rotary pulley. The housing portion includes a rotary bearing(51) and a housing(52). A fixing plate(53) is extended to a linear guide(54). A transferring plate(57) is connected wit the linear guide block(54). A motor(58) is fixed to one side of the fixing plate(53). The transferring portion(30) includes a rotary plate(31), a position control liner guide(32), the vacuum shaft(33), a recovery spring(35), and a shaft support(36).
申请公布号 KR20030024511(A) 申请公布日期 2003.03.26
申请号 KR20010057746 申请日期 2001.09.18
申请人 DNC ENGINEERING CO., LTD. 发明人 CHOI, YANG HWAN
分类号 H01L21/68;H01L21/677;(IPC1-7):H01L33/00 主分类号 H01L21/68
代理机构 代理人
主权项
地址