发明名称 METHOD AND DEVICE FOR FORMING FILM
摘要 The prevent invention improves the film thickness distribution in the direction of revolution of substrates by a simple manner in a method for forming coating films, wherein a evaporating source 3 is disposed at a predetermined distance from substrates 2, and when a coating film material is applied from the evaporating source 3 onto the substrate surfaces while revolving the substrates 2, coating films are formed on the substrate surfaces in a condition where the radius of curvature of the substrates 2 obtained by bending the substrates 2 within the elasticity range is made equal to the radius of revolution of the substrates 2.
申请公布号 KR20030024824(A) 申请公布日期 2003.03.26
申请号 KR20037001530 申请日期 2003.02.03
申请人 发明人
分类号 C23C14/24;C03C17/00;C03C17/34;C23C14/50 主分类号 C23C14/24
代理机构 代理人
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