| 摘要 |
PURPOSE: A semiconductor package fabrication apparatus is provided to reduce working hours by automatizing a dispensing process, a glass bonding process, and a cure process. CONSTITUTION: A loader portion(20) transfers a boat loaded into a magazine to a conveyer. A dispensing portion(30) is connected with the leader portion(20) by a conveyer(C1). The dispensing portion(30) coats UV epoxy on a package of the transferred boat. A glass bonding portion(50) is connected with the dispensing portion(30). The glass bonding portion(50) performs a glass bonding process for the package of the boat coated with the UV epoxy. An ejecting portion ejects the bad package. An UV cure portion(70) performs the first hardening process for the UV epoxy of the package. A hot cure portion(80) performs the second hardening process for the UV epoxy of the package. An unloader portion(90) separates the package from the boat. A control portion control operations of each part.
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