发明名称 METHOD OF FABRICATING CAPACITOR OF SEMICONDUCTOR MEMORY DEVICE FOR CONTROLLING THERMAL BUDGET
摘要 PURPOSE: A method of fabricating a capacitor of a semiconductor memory device for controlling a thermal budget is provided to prevent leakage current by performing a preheating process for a bottom electrode in a thermal process for crystallizing a dielectric layer. CONSTITUTION: A bottom electrode(22a) is formed on an upper surface of a semiconductor substrate(10). A thermal process for the bottom electrode(22a) is performed by using the first thermal budget. A dielectric layer(32) is formed on the bottom electrode(22a). The dielectric layer(22a) is crystallized by using the second thermal budget. The bottom electrode(22a) is formed with noble metal, conductive noble metal oxide, and conductive metal oxide. The bottom electrode(22a) is formed with Pt, Ru, Ir, PtO, RuO2, IrO2, SrRuO3, BaSrRuO3, or LaScCo.
申请公布号 KR20030024212(A) 申请公布日期 2003.03.26
申请号 KR20010057263 申请日期 2001.09.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG, DU SEOP;JU, JAE HYEON;JUNG, EUN AE;JUNG, YONG GUK;KIM, WAN DON;YOO, CHA YEONG
分类号 H01L27/04;H01L21/02;H01L21/314;H01L21/316;(IPC1-7):H01L27/04 主分类号 H01L27/04
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