发明名称 |
METHOD OF FABRICATING CAPACITOR OF SEMICONDUCTOR MEMORY DEVICE FOR CONTROLLING THERMAL BUDGET |
摘要 |
PURPOSE: A method of fabricating a capacitor of a semiconductor memory device for controlling a thermal budget is provided to prevent leakage current by performing a preheating process for a bottom electrode in a thermal process for crystallizing a dielectric layer. CONSTITUTION: A bottom electrode(22a) is formed on an upper surface of a semiconductor substrate(10). A thermal process for the bottom electrode(22a) is performed by using the first thermal budget. A dielectric layer(32) is formed on the bottom electrode(22a). The dielectric layer(22a) is crystallized by using the second thermal budget. The bottom electrode(22a) is formed with noble metal, conductive noble metal oxide, and conductive metal oxide. The bottom electrode(22a) is formed with Pt, Ru, Ir, PtO, RuO2, IrO2, SrRuO3, BaSrRuO3, or LaScCo.
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申请公布号 |
KR20030024212(A) |
申请公布日期 |
2003.03.26 |
申请号 |
KR20010057263 |
申请日期 |
2001.09.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG, DU SEOP;JU, JAE HYEON;JUNG, EUN AE;JUNG, YONG GUK;KIM, WAN DON;YOO, CHA YEONG |
分类号 |
H01L27/04;H01L21/02;H01L21/314;H01L21/316;(IPC1-7):H01L27/04 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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