| 摘要 |
PURPOSE: A chemical mechanical polishing apparatus is provided to not only polish the surface of a wafer uniformly but also prevent the wafer from being squeezed out by making the edge of grooves on a retainer ring round. CONSTITUTION: A chemical mechanical polishing apparatus has polishing head, a head-retainer ring. Many grooves(130) are formed on the bottom side of the head-retainer ring, being warped from the inside to the outside depending on the turning direction of the upper part of the polishing head relative to that of the head-retainer ring. The edge around the bottom of each groove is made round.
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