SEMICONDUCTOR DEVICE

摘要

PURPOSE: To prevent defects such as leakage and short circuits due to ion migration. CONSTITUTION: A semiconductor device comprises a plurality of inner leads 1a formed of copper or copper alloy, a heat radiation plate 3 which is formed of copper or copper alloy and is bonded to one end of each of the plurality of inner leads 1a via an adhesive layer 2 and is mounted with a semiconductor element 4 via the adhesive layer 2, a plurality of metal fine lines 6 which connects the semiconductor element 4 and each of the plurality of inner leads 1a, a sealing resin 8 for sealing the semiconductor element 4 and a plurality of metal fine lines 6, and a plurality of gull wing-like outer leads 1b projecting outside the sealing resin 8. the sealing resin 8 is added with an additive such as an ion trapping agent which combines with ionic impurities, thereby making the water nearly neutral in a releasing section, which hardly causes copper to react and elute and thereby prevents Cu migration.