RELIABLE SOLDER STRUCTURE HAVING CAVITY AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A reliable solder structure having a cavity and a method for fabricating the same are provided to improve the reliability of contact between a chip and a printed circuit board by forming a cavity on a solder structure. CONSTITUTION: A barrel-shaped solder structure(26) has a center cavity(28). The first seeding point is formed on a ring-shaped center portion having non-conductivity and non-wetting by forming an annular conductive pad(30) instead of a circular conductive pad on an upper plane element(14). The first internal cavity is formed by surface tension and viscosity of a melted solder. An internal cavity(28) is formed since a lower plane element(18) includes a ring-shaped conductive pad(32) and the second seeding point. A plurality of holes(34,36) are formed on the annular conductive pad(30) and the ring-shaped conductive pad(32), respectively.