摘要 |
PURPOSE: A bake apparatus and a baking method using the same are provided to maintain baking uniformity constantly by installing an alignment portion at a bake plate in order to align a flat zone of a wafer. CONSTITUTION: A bake unit is formed with a chamber(110), a bake plate(120), a wafer support pin(122), and a wafer alignment portion(130). The bake plate(120) is installed in the inside of the chamber(110). A wafer is loaded on the bake plate(120). The wafer support pin(122) is installed at the bake plate(120). The wafer support pin(122) is used for loading the wafer into the bake plate(120) or unloading the wafer from the bake plate(120). The wafer alignment portion(130) is used for aligning a flat zone of the wafer. The wafer alignment portion(130) is formed with a spin chuck(132), a motor(134), and a sensor(136).
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