METHOD FOR CLEANING SURFACE OF SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for highly efficiently cleaning a substrate, by which both of a particle-shaped contaminant and a metallic contaminant can be removed in a short time while extremely reducing the occurrence of such a problem that the removed contaminants are stuck to the substrate again and the processed dimensions of the substrate are deformed by etching. SOLUTION: This method comprises at least two following steps (1) and (2). The second cleaning step (2) is carried out after the first cleaning step (1). In the first cleaning step (1), the surface of the substrate is cleaned by using a complex forming agent-containing alkaline detergent. In the second cleaning step (2) the substrate is cleaned by using another detergent having 0.03-3 wt.% hydrofluoric acid content C for <=45 seconds cleaning time t while satisfying the inequality: 0.25<=tC<1.29> <=5.