发明名称 Method for manufacturing raised electrical contact pattern of controlled geometry
摘要 An interposer includes a substrate having opposing surfaces. Conductive terminals are disposed on both surfaces, and conductive terminals on one surface are electrically connected to conductive terminals on the opposing surface. Elongate, springable, conducive interconnect elements are fixed to conductive terminals on both surfaces.
申请公布号 US6538214(B2) 申请公布日期 2003.03.25
申请号 US20010848854 申请日期 2001.05.04
申请人 FORMFACTOR, INC. 发明人 KHANDROS IGOR Y.
分类号 B23K1/00;C23C18/16;C25D7/12;G01R1/04;G01R1/067;G01R1/073;G01R3/00;G01R31/28;H01L21/00;H01L21/48;H01L21/56;H01L21/60;H01L21/66;H01L23/48;H01L23/485;H01L23/49;H01L23/498;H01L25/065;H01L25/16;H05K1/14;H05K3/30;H05K3/32;H05K3/34;H05K3/36;H05K3/40;H05K7/10;(IPC1-7):H05K7/02;H05K7/06 主分类号 B23K1/00
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