发明名称 |
Single-substrate-heat-processing apparatus for semiconductor process |
摘要 |
A higher-temperature heating zone and lower-temperature heating zone are set in a process chamber for a single-substrate-heat-processing apparatus in order to subject a wafer to two processes with different process temperatures. In the higher-temperature heating zone, the wafer is heated as it is placed on a worktable. In the lower-temperature heating zone, the wafer is heated with a smaller heat quantity as it floats above the worktable. In the lower-temperature heating zone, a heat ray reflector for compensating for heat dissipated from the peripheral portion of the wafer is disposed to surround the wafer.
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申请公布号 |
US6537422(B2) |
申请公布日期 |
2003.03.25 |
申请号 |
US20010839292 |
申请日期 |
2001.04.23 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
SAKUMA TAKESHI;HOMMA KENJI;HORIGUCHI TAKAHIRO |
分类号 |
F27B1/09;C23C16/46;F27D3/12;F27D11/02;H01L21/00;H01L21/302;H01L21/3065;H01L21/31;(IPC1-7):H01L21/306 |
主分类号 |
F27B1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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