| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal foil with resin in which dispersion of the thickness of an interlayer insulating resin is controlled and to provide a multi-layer printed circuit board. SOLUTION: The metal foil with the resin (especially copper foil with the resin) has at least two resin layers composed of an insulating resin composition containing the metal foil and a benzocyclobutene resin. In the multi-layer printed circuit board, the metal foil with the resin is laid on one surface or both surfaces of an inner layer circuit board to overlap each other and hot-pressed. |
