发明名称 |
Multi-layer conductor system with intermediate buffer layer for improved adhesion to dielectrics |
摘要 |
A multi-layer conductor system including: a base layer having an electrically insulative top portion including alumina; an electrically conductive intermediate layer formed on the top portion of the base layer; and an electrically conductive top layer formed on the intermediate layer; wherein the intermediate layer includes alumina and a precious metal alloy consisting of silver and a precious metal other than silver; wherein the top layer comprises a precious metal selected from the group consisting of silver and a silver alloy such that the difference between the percentage weight of silver in the precious metal of the top layer and the percentage weight of silver in the precious metal alloy of the intermediate layer is limited to thereby provide advantages in use.
|
申请公布号 |
US6538325(B2) |
申请公布日期 |
2003.03.25 |
申请号 |
US20010799326 |
申请日期 |
2001.03.06 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
LAUTZENHISER FRANS PETER |
分类号 |
H01L23/498;H05K1/09;H05K3/24;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/498 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|