发明名称 |
Heat sink element and high-frequency electronic circuit substrate using such |
摘要 |
A heat sink element in the form of a coil with a high thermal conductivity is formed. One end of the heat sink element is directly connected to a circuit element connection conductor under a high potential in a high-frequency circuit mounted on an electronic circuit substrate, and the other end thereof is directly secured to a metal case having the electronic circuit substrate contained therein. As a result, the heat sink element serves as a heat channel transferring the heat generated due to the temperature increase in the circuit element connection conductor to the metal case by means of thermal conductivity.
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申请公布号 |
US6538890(B2) |
申请公布日期 |
2003.03.25 |
申请号 |
US20010006676 |
申请日期 |
2001.12.10 |
申请人 |
KOKUSAI DENKI ENGINEERING CO., LTD. |
发明人 |
KODAKA CHOICHIROU;SHINDO MASAHIRO;ITO TADASHI |
分类号 |
H04B1/036;H04B1/04;H05K1/02;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H04B1/036 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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