发明名称 |
Electronic component, method for producing electronic component, and circuit board |
摘要 |
An electronic component includes external electrodes formed on a base member, each external electrode including a plurality of layers of which the outermost layer is a tin plating layer. The tin plating layer has a polycrystalline structure, and atoms of a metal other than tin are diffused into the tin crystal grain boundaries. Alternatively, each external electrode includes a plurality of layers including a thick-film electrode formed on the base member, a nickel layer or a nickel alloy layer formed on the thick-film electrode and a tin plating layer formed on the nickel layer or the nickel alloy layer. The tin plating layer has a polycrystalline structure and nickel atoms are diffused into the tin crystal grain boundaries. Methods for fabricating electronic components and a circuit board provided with a plurality of electronic components are also disclosed.
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申请公布号 |
US6537685(B2) |
申请公布日期 |
2003.03.25 |
申请号 |
US20010863045 |
申请日期 |
2001.05.22 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
HIGUCHI SHOICHI |
分类号 |
C25D7/00;B32B15/01;B32B15/04;C22F1/00;C25D3/30;C25D5/00;C25D5/12;C25D5/48;C25D5/50;C25D7/12;H01G4/12;H01G4/228;H01G4/232;H01G4/252;H01G4/30;H05K1/18;H05K3/34;(IPC1-7):B32B15/01 |
主分类号 |
C25D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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