发明名称 |
Surface mount type electronic component |
摘要 |
A surface mount type electronic component includes a substantially rectangular case substrate, an electronic element mounted on the case substrate along the longitudinal direction, and a cap which is fixed onto the case substrate in such a manner as to cover the electronic element. First and second top-surface electrodes and first and second bottom-surface electrodes, which extend along the width direction of the case substrate, are arranged with a spacing on the top surface and the bottom surface of the case substrate, respectively. The first top-surface electrode and the first bottom-surface electrode are connected to each other via a first side electrode disposed on the side surface of the case substrate, and the second top-surface electrode and the second bottom-surface electrode are connected to each other via a second side electrode disposed on the side surface of the case substrate.
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申请公布号 |
US6538896(B2) |
申请公布日期 |
2003.03.25 |
申请号 |
US20020121732 |
申请日期 |
2002.04.15 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KAMEDA EITARO;BABA TOSHIYUKI;KURODA HIDEAKI;MORIMOTO YASUHIRO |
分类号 |
H01L23/04;H01L41/053;H03H9/02;H03H9/10;H03H9/13;H03H9/17;H05K3/34;(IPC1-7):H05K7/02;H05K1/02;H01L41/04 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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