Package base for mounting electronic element, electronic device and method of producing the same

摘要

A package base for mounting an electronic element, an electronic device using the package base, particularly a crystal resonator. The package base comprises an insulative substrate, and an internal electrode formed at a predetermined position on the substrate, the internal electrode being bonded to the electronic element. A junction member comprising a junction layer composed of a conductive junction alloy having a melting point higher than the mounting temperature and an anti-oxidation conductive layer covering the junction layer is further provided on the internal electrode.