发明名称 |
Semiconductor device and method of manufacturing same |
摘要 |
A semiconductor device has (a) a semiconductor component; (b) a circuit substrate; (c) a base material which is placed between the semiconductor component and the circuit substrate; and (d) a conductive paste, which is filled into a hole formed in the base material, for electrically connecting between a terminal electrode of the semiconductor component and an internal connection electrode of the circuit substrate. |
申请公布号 |
US6538315(B2) |
申请公布日期 |
2003.03.25 |
申请号 |
US20000742973 |
申请日期 |
2000.12.20 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
BESSHO YOSHIHIRO;ITAGAKI MINEHIRO |
分类号 |
H01L21/56;H01L21/60;H01L23/498;(IPC1-7):H01L23/04 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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