| 摘要 |
PROBLEM TO BE SOLVED: To reduce friction heat energy and vibration energy to be applied to an electronic part at the time of ultrasonic welding to prevent the destruction of the electronic part. SOLUTION: In the ultrasonic welding device for bonding two resin cases 3, 4 holding a substrate 1, on which the electronic part 2 is mounted, by ultrasonic welding, a recessed part 5a is formed to a welding contact surface coming into contact with the upper resin case 3 from above and, at the time of ultrasonic welding, the welding contact surface is arranged so that the electronic part 2 of the substrate 1 held by two resin cases 3 and 4 and the recessed part 5a are mutually opposed through the upper resin case 3. Further, the electronic part-mounted module is constituted so that a lower recessed part 4b for housing the electronic part 2 is formed on the upper surface of the lower resin case 4, and an upper recessed part 3a having a shape smaller than the outer shape of the substrate 1 but larger than the shape of the mounted electronic part 2 is formed on the upper surface of the lower resin case 4. |
