| 发明名称 |
Corner bonding to lead frame |
| 摘要 |
A lead frame for an integrated circuit includes a ground for the integrated circuit to ground the integrated circuit, the lead frame having at least one corner connected to the ground; and a connector between the corner of the lead frame and the ground located on the integrated circuit.
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| 申请公布号 |
US6538304(B1) |
申请公布日期 |
2003.03.25 |
| 申请号 |
US20000715383 |
申请日期 |
2000.11.16 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
WHITE BERTRAM J. |
| 分类号 |
H01L23/495;H01L23/50;H01L23/528;H01L23/60;(IPC1-7):H01L23/48;H01L27/10;H01L23/52;H01L23/06;H02H1/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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